Honzon Smartphone Ring "Tenpuru"

※Please note that product information is not in full comprehensive meaning because of the machine translation.
Japanese title: 携帯サプライ ご本尊 スマホリング 「てんぷる」
1,760JPY
1,053JPY
0JPY
Quantity:
+
Add to wishlist
Item number: 878047810
Released date: 20 Oct 2023

Product description ※Please note that product information is not in full comprehensive meaning because of the machine translation.

Product Description ■ Introducing a smartphone ring from "Tenpuru".
[Product Details]
Size : approx. W43 x H55mm or less
Materials : acrylic, zinc-alloy, brass
(C) Yoshioka Kimitake kodansha / Tenpuru Production Committee